Newsletter (August 2012)

August 15,2012

82012.jpgIn this summer issue of Nanoscribe’s “News and Reviews” you are invited to have a closer look at latest applications and most recent technological developments in 3D laser lithography, e.g., pioneering results of chip-to-chip optical interconnects (so-called Photonic Wire Bonds). Unprecedented possibilities, e.g., in the fabrication of mechanical meta- as well as ultralight materials are enabled by our index-matched new photoresist IP-Dip. The newsletter is availabe for download as PDF document or by following this link.