News and Reviews

March 2019


 
 
 
News & Reviews: High-Resolution 3D-Printed Stamps for Printing Electronics
Nanoscribe Newsletter
In this issue we gladly present a new approach by our customers to solve common defects of roll-to-roll processes by 3D printing high-resolution stamps. Furthermore, we would like to point out how the new Photonic Professional GT2 systems change the way of producing micro-optics in series. Finally, you are cordially invited to join us at PIC International Conference 2019!

Enjoy reading!
Your Nanoscribe team
 

Electronic components can also be manufactured by roll-to-roll processes, where a special stamp transfers the printing material to the substrate. However, common defects, such us haloing or bridging, negatively affect the performance of printed materials for electronics applications. This problem can be solved with a new approach using 3D-printed mechanical metamaterials for metered ink deposition. More
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The new Photonic Professional GT2 systems change the way of producing micro-optics in series. Additively manufactured ultra-precise micro-optics fit as polymer masters into established industrial processes for serial production. More
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Scientists at the Karlsruhe Institute of Technology (KIT) and Carl Zeiss AG present a new method for high-precision additive manufacturing of micro- and nanostructures composed of multiple materials. More
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Are you interested in innovative manufacturing methods for integrated photonic devices? Then visit us on 26 or 27 March 2019 at the PIC International Conference in Brussels. More
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Upcoming Exhibitions
LASER World of Photonics China
Shanghai (CN)
March 20 - 22, 2019
Booth: 6220 (Hall OW)
Photonic Integrated Circuits (PIC) Conference
Brussels (BE)
March 26 - 27, 2019
Korean MEMS
Jeju (KR)
April 04 - 06, 2019
 
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